Photonic integration innovator, ColorChip, demonstrates building blocks for data center interconnects beyond 100G

http://www.prnewswire.com/news-releases/colorchip-demonstrates-three-generations-backward-compatibility-from-400g-200g-to-100g-cwdm4-pluggable-optical-modules-300427910.html

LOS ANGELES, March 22, 2017 /PRNewswire/ — ColorChip today announced several optical products and technology demonstrations to be presented this week during the OFC exhibition.   The new building blocks and products feature uncooled CWDM4 DML’s driving both PAM4 and NRZ modulation and packaged in QSFPx form factors.

Industry First 200G QSFP56 PAM4 with CWDM4 DML

During OFC, ColorChip will present several demonstrations using uncooled CWDM4 DML technology, including the exhibition of 200G PAM4.  The demonstration will consist of TOSA and ROSA based on ColorChip’s patented SystemOnGlass™ platform, leveraging field proven 40G/100G deployment with extension beyond 400G.  The link demonstrates the building blocks towards the realization of a compact, low power consumption 200G PAM4 transceiver, on the CWDM4 grid, packaged in a compact QSFP56 form factor and with a standard Duplex LC optical interface.

2x100G CWDM4 in QSFP-DD

ColorChip will additionally exhibit a 2x100G “two in a box” demo highlighting ColorChip’s SystemOnGlass™ solution facilitating the implementation of an 8 channel TOSA and ROSA to create a Dual CWDM4 transceiver in either QSFP-DD or OSFP. The 8 channel optical engines, which include dual embedded CWDM4 multiplexers, will be displayed in QSFP-DD. The 2x100G CWDM4 QSFP-DD transceiver is characterized by an 8x25G NRZ electrical interface and Dual Duplex-LC optical connectors.

100G CWDM4 QSFP28 in Mass Production and OCP-Accepted™

The ColorChip 100G CWDM4 OCP-accepted™ transceiver is in high volume production. It is a unique optical interconnect with a power consumption of only 2.6W and operates over a distance of 500 meters, which can be extended to 10km, meeting 4WDM-10 MSA specification and covering both across-datacenter and campus connectivity requirements.

Hyper-Scale Optical Module High Volume Manufacturing  

Datacenter growth is progressing at unprecedented rates.  In order to meet the volume demand, ColorChip has completed $60M in funding over the past 18 months; significantly expanding its industrialized-optics TOSA/ROSA assembly lines in Israel and also teaming up with Contract Manufacturer Fabrinet on the optical module integration and final test activities.  In the past 6 months, ColorChip has doubled its production floor space to 20,000 square feet as well as increasing the head count to over 300 employees.

About ColorChip:

ColorChip (http://www.color-chip.com) is a global provider of hyper-scale optical transceivers supporting the growing need for bandwidth scale. ColorChip is headquartered in Yokne’am, Israel, where it’s fully owned, industrialized optics-based FAB is dedicated to the production of PLC based SystemOnGlass™, a dense, multi-lane, hybrid photonic integrated circuit used as the foundation of the company hyper scale Transceivers, providing a platform of scalability that seamlessly transitioned from 40G to 100G moving towards 200G, 400G and beyond as its natural horizons. ColorChip has a production facility in Thailand and offices in San Jose, California.


Visit ColorChip during the OFC exhibition at the Los Angeles Convention Center in Los Angeles, USA from March 21st to 23rd in booth #3239 to learn more about our extended family of 40G and 100G optical transceivers and our roadmap to 200G and 400G. Please contact us at info@color-chip.com to set up a meeting.   For more information on ColorChip, please visit www.color-chip.com

Media Coverage

Noa Kotok
Manager, Sales & Marketing
+972.50.337.7716
noa@color-chip.com

SOURCE ColorChip

Related Links

http://www.color-chip.com